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BGA pad opening

Reason of failed review:

The BGA pad opening is smaller than the copper layer pad, we need to confirm if it according to the copper layer pad to open or you need to revise the file.

Suggestion:

The solder mask pad opening needs to be larger than the copper layer pad 2—4mils.

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The parameters in gerber files are different from the order details online.
Some Issues concerning BGA(Ball Grid Array)
Design has no silkscreen layer but online is yes with silkscreen
The are some pads out of the board outline
UL Marking
No Gold fingers design in file
Spiral coil board
the spacing requirement from slot to copper trace
Edge plating
the spacing requirement from hole to the edge of board
The spacing from one hole to another is too narrow
The requirement of beveling on gold finger area
the spacing from hole to trace
limited holes spacing
the bottom silkscreen is mirrored
notes in the order are different from the designs in the files
do not design texts on the copper layer
Silkscreen standard size
silkscreen size and spacing in solder mask layer

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BGA pad opening

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