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The non plated holes break traces

Reason of review failure.

Per file, some holes are designed on traces. In this way, when drill the holes, traces will break as well.

Suggestion:

When you make design next time, please make sure there is no such hole on traces. Please move them to be aside of tracecs.

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The parameters in gerber files are different from the order details online.
Some Issues concerning BGA(Ball Grid Array)
Design has no silkscreen layer but online is yes with silkscreen
The are some pads out of the board outline
UL Marking
No Gold fingers design in file
BGA pad opening
Spiral coil board
the spacing requirement from slot to copper trace
Edge plating
the spacing requirement from hole to the edge of board
The spacing from one hole to another is too narrow
The requirement of beveling on gold finger area
the spacing from hole to trace
limited holes spacing
the bottom silkscreen is mirrored
notes in the order are different from the designs in the files
do not design texts on the copper layer
Silkscreen standard size
silkscreen size and spacing in solder mask layer

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The non plated holes break traces

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