A component lead that extends through a hole and is terminated without subsequent forming.
A method by which successive exposures of a single image are made to produce a multiple-image production master.
The making of solder connections by sequentially using solder alloys with successively lower melting temperatures.
The use of statistical techniques to analyse the outputs of processes with the results guiding actions taken to adjust and/or maintain a state of quality control.
Wiring which is produced by die stamping and which is bonded to an insulating base.
A method of connecting a solid wire to a square, rectangular, or V-shaped terminal by tightly wrapping the wire around the terminal with a special tool.
A process of joining metallic surfaces with solder, without the melting of the base metals.
The portion of a soldering iron that is used for the application of the heat that melts the solder.
An ink, lacquer, photo-resist or metal coating which is not wetted by molten solder. It is applied to specific areas of a PCB to stop them from being solder-coated, usually when mass soldering.
Finely divided particles of solder, with additives to promote wetting and to control viscosity, tackiness, drying rate, etc.
Liquid formulations that are used in intermix wave soldering and as coverings on static and wave soldering pots in order to eliminate dross and to reduce surface tension during the soldering process.
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1 | PCBWay Team | 5 |