Physical Layer

A conductive board layer or artwork image representing a complete conductive layer.

Physical Layer

Photoplotter

A plotter that writes using light.

Photoplotter

Photopolymer

A polymer that changes characteristics when exposed to light of a specific frequency.

Photopolymer

Photomaster

See Artwork Master.

Photomaster

Permanent Mask

A resist which is not removed after processing, e.g., plating resist used in the fully-additive process.

Permanent Mask

Peel Strength

The force per unit width required to peel the conductor or foil from the base material.

Peel Strength

PEC

Printed Electronic Component.

PEC

PCB

Printed Circuit Board.

PCB

Pattern

The configuration of all conductive and/or non-conductive areas on a PCB. Letters and inscription may also be included. Pattern also denotes the circuit configuration on related tools, drawing and mas...

Pattern

Pattern Plating

 Selective plating of a conducive pattern.

Pattern Plating

Parylene

A polymer resin (Polyparaxylense) that provides a thin, uniform coating on PCBs and components. It can be applied via vacuum for deposition on sharp edges and complex shapes.

Parylene

Panel Plating

The plating of the entire surface of a panel (including holes).

Panel Plating

Panel

The base material containing one or more circuit patterns that passes successively through the production sequence and from which printed circuit boards are extracted. See Backplanes/Backpanels.

Panel

Pad

A portion of the conductive area of which components, terminals, traces, etc., are mechanically attached.  (Also called land).

Pad

Packaging Density

Quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.

Packaging Density

Overhang

Increase in printed circuit conductor width caused by plating build-up or by undercutting during etching.

Overhang

Outgrowth

The increase in conductor width at one side of a conductor, caused by plating build-up, over that delineated on the production master.

Outgrowth

Outgassing

The gaseous emission from a laminate printed board or component when the board or the printed board assembly is exposed to heat or reduced air pressure or both.

Outgassing

OSP

Organic Solderable Preservative.

OSP

Organic Activated (OA)

A water-soluble flux using organic acids as activators.

Organic Activated (OA)

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