A resist which is not removed after processing, e.g., plating resist used in the fully-additive process.
The force per unit width required to peel the conductor or foil from the base material.
The configuration of all conductive and/or non-conductive areas on a PCB. Letters and inscription may also be included. Pattern also denotes the circuit configuration on related tools, drawing and mas...
A polymer resin (Polyparaxylense) that provides a thin, uniform coating on PCBs and components. It can be applied via vacuum for deposition on sharp edges and complex shapes.
The base material containing one or more circuit patterns that passes successively through the production sequence and from which printed circuit boards are extracted. See Backplanes/Backpanels.
A portion of the conductive area of which components, terminals, traces, etc., are mechanically attached. (Also called land).
Quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.
Increase in printed circuit conductor width caused by plating build-up or by undercutting during etching.
The increase in conductor width at one side of a conductor, caused by plating build-up, over that delineated on the production master.
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