One in a series of levels in a board on which tracks are arranged to connect components. Vias connect tracks and zones between layers.
The thickness of dielectric material between adjacent layers of conductive circuitry in a multi-layer printed circuit board.
A combination of lands that is used to mount, interconnect and test a particular component.
The process of manufacturing a laminate; also the process used for application of a dry film photo-resist.
Multi-layer equipment that applies both pressure and heat to laminate and prepreg to make multi-layer boards.
Thickness of the metal clad base material, single- or double-sided, prior to any subsequent processing.
A slot in a printed circuit board that polarizes it, thereby permitting it to be plugged into its mating receptacle with pins properly aligned, but preventing it from being reversed or plugged into an...
Minimization of inventory by supplying material and components to the production line directly before placement into the product.
Ranking | Name | Answers |
---|---|---|
1 | PCBWay Team | 9 |
2 | Xiaoyang Ma | 1 |
3 | Engineer | 1 |
4 | Christian Davies | 1 |