The force necessary to rupture a plated through-hole when loaded or pulled in the direction of the axis of the hole.
The part of a lead adjacent to a termination that has been deformed by the edge of the bonding tool.
Any device that absorbs and draws off heat from a hot object, radiating it into the surrounding atmosphere.
A de-soldering method using a device that grasps, heats and pulls the leads to be removed.
Induced fracturing or de-lamination on or below the surface of the base material, it is usually exhibited by a light area around holes, other machined areas, or both.
Compounds containing fluorine, chlorine, bromine or iodine, which may be part of the activators in the flux system and must be cleaned.
A technique for volume production of PCBs based on incoming inspection to catch the majority of device failures and inspection prior to populating, that will eliminate most manufacturing errors. ...
Removed portions of a ground plane that serves to isolate it form a hole in the base material to which the plane is attached
A conductor layer, or portion of a conductor layer, used as a common reference point for circuit returns, shielding, or heat sinking. All those areas, not consumed by traces or pads, of the PCB which ...
Ranking | Name | Answers |
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1 | PCBWay Team | 9 |
2 | Xiaoyang Ma | 1 |
3 | Engineer | 1 |
4 | Christian Davies | 1 |