J-leads

The preferred surface mount lead form used on PLCCs, so named because the lead departs the package body near its Z-axis centre-line, is formed down the rolled under the package. Leads so formed are sh...

J-leads

Isolation

The clearance around a pad, track, zone or via that defines the nearest approach allowed by conductors of another signal set.

Isolation

IPC

The Institute for Interconnecting and Packaging Electronic Circuits, an American organization.

IPC

Interstitial Via Hole

A plated through-hole connecting two or more conductor layers of a multilayer printed board but not extending fully through all the layers of base material comprising the board.

Interstitial Via Hole

Internal Layer

A conductive pattern which is contained entirely within a multi-layer printed board.

Internal Layer

Inter-layer Connection

An electrical connection between conductive patterns in different layers of a multi-layer printed board. (See also Through Connection.)

Inter-layer Connection

Inter-facial Connection

See Through Connection.

Inter-facial Connection

Insulation Resistance

The electrical resistance of the insulating material (determined under specified conditions) between any pair of contacts, conductors, or grounding device in various combinations. The electrical...

Insulation Resistance

Inspection Overlay

A positive or negative transparency made from the production master and used as an inspection aid.

Inspection Overlay

Inspection Lot

A collection of units of products bearing identification and treated as a unique entity from,which a sample is to be drawn and inspected to determine conformance with the acceptability criteria. ...

Inspection Lot

Initiating

see "activating".

Initiating

INDEX EDGE

INDEX EDGE MARKER, INDEXING HOLE, INDEXING NOTCH, INDEXING SLOT: See Locating Edge, Location Edge Marker,etc.

INDEX EDGE

Inclusion

A foreign particle in the conductive layer, plating, or base material.

Inclusion

In-circuit Test

A check of specific components(s) or cuicuits(s) within an assembly without their de-coupling from the primary circuit.

In-circuit Test

Impedance, Characteristic

The resistance of a parallel conductor structure to the flow of alternating current (ac), usually applied to high-speed circuits and normally consisting of a constant value over a wide range of freque...

Impedance Characteristic

Immersion Plating

The chemical deposition of a thin metallic coating over certain basis metals that is achieved by a partial displacement of the basis metal.     

Immersion Plating

Indentation

See “Pit”

Indentation

IC

Integrated Circuit.

IC

Hygroscopic

The ability of a material to absorb and retain moisture from the air.

Hygroscopic

Hot Zone

The section of a re-flow oven held at maximum temperature. Other zones include per-heat and cooling.

Hot Zone

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