Muffle

An enclosure that is located between the heating elements and the parts being processed that contains the atmosphere required for the re-flow soldering process.

Muffle

Mounting Hole

A hole used for the mechanical mounting of a printed board or for the mechanical attachment of components to the printed board .  

Mounting Hole

Mother Board

Also called back plane, or matrix board. A relatively large printed circuit board on which modules, connectors, sub-assemblies or other printed circuit boards are mounted and inter connections made by...

Mother Board

Module

A separable unit in a packaging scheme displaying regularity of dimensions.

Module

Modifier

A chemically inert substance added to a resin to change its properties.

Modifier

Mixed Component-Mounting Technology

A component mounting technology that uses both through-hole and surface-mounting technologies on the same packaging and interconnecting structure.

Mixed Component-Mounting Technology

Mis-registration

The lack of dimensional conformity between successively produced features or terns.

Mis-registration

Minor Defect

A defect which is not likely to reduce the usability of the unit for its intended purpose, It may be a departure from established standard having no significant bearing on the effective use or operati...

Minor Defect

Minimum Electrical Spacing

The minimum allowable distance between adjacent conductors that is sufficient to prevent dielectric breakdown, between the conductors at any given voltage.

Minimum Electrical Spacing

Mil

One thousandth (0.001) of an inch. Not to be confused with Mil (short for millimetre).1Inch=25.4mm; 1mil=0.0254mm.

Mil

Micro-strip

A type of transmission line configuration which consists of a conductor over a parallel ground plane, and separated by a dielectric.

Micro-strip

Micro-sectioning

 A destructive test procedure in which a section of specimen it cut and removed for close examination.

Micro-sectioning

Metallization

A deposited or plated thin metallic film used for its protective or electrical properties.

Metallization

Metal Clad Base Material

Base material covered with metal on one or both of its sides.

Metal Clad Base Material

Meniscus

The contour or shape of molten solder as formed by surface tension forces in turn controlled by wetting.

Meniscus

Melting Range

The temperature range over which the solder alloy melts .An alloy with a single melting point, rather than a melting range, is known as a eutectic alloy .

Melting Range

MELF

A metal electrode leadless face surface mount component that is round with metallic cap terminations.

MELF

Measling

A condition existing in the base laminate in the form of discrete white sports or crosses below the surface of the base laminate, reflecting a separation of fibres in the glass cloth at the weave inte...

Measling

Mean Time between Failure (MTBF)

The statistical mean average time interval, usually in hours, that may be expected between failures of an operating unit. Results should be designated actual. Predicted or calculated.

Mean Time between Failure (MTBF)

MCR

Moulded Carrier Ring. A tape of fine-pitch chip package named for the method of supporting and protecting the leads. The leads are left straight; the ends of the leads are embedded in a strip of plast...

MCR

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Ranking Name Answers
1 PCBWay Team 9
2 Xiaoyang Ma 1
3 Engineer 1
4 Christian Davies 1
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